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10 merged results for "IEEE Transactions on Components Packaging and Manufacturing Technology"

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  1. SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

    Mesut Inaç · 2018

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.1109/ectc.2017.153

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  2. Structured Channel Estimation for RIS-Assisted THz Communications

    6G-MUSICAL · 2025

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.1109/tvt.2024.3492998

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  3. Investigation of the adhesive properties of composites based on polyimide varnish and copper oxide, boron nitride and technical diamond powders

    Belyakov, Igor A., Kochergin, Mikhail D., Solovyov, Ilya A., Kurbatov, Vladimir G. · 2025 · Modern Electronic Materials

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.3897/j.moem.11.3.143013

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  4. A Systematic Literature Review of Advanced Packaging Technology in Semiconductors: Revolutionizing the Industry

    Rajat Suvra Das · 2023 · European Journal of Advances in Engineering and Technology

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.10901195

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  5. Improving TSV Efficiency in 3D ICs Using Perylene-N for Enhanced Noise Reduction

    T.C. Sanjeeva Rayudu, P. Rajeswari, K. Joshmitha, D. Sathish · 2025 · Journal of Optoelectronics and Communication

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.15118683

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  6. HADRO-SoC: Reinventing AI Acceleration with Neuromorphic, In-Memory, and Graph-Aware Chip Design

    ZAIDI, ADNAN HAIDER · 2024 · Classified Military Systems Engineering Journal (CMSEJ)

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.16459495

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  7. System-on-Chip for Cross-Domain Transformer-Based AI with Physics-Informed Neural Logic and Real-Time Edge Inference

    ZAIDI, ADNAN HAIDER · 2023 · International Research Journal for Avionics ,Aerospace and Electronics

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.16460688

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  8. Uncertainty and Business-Aware Remaining Useful Life Estimation for Semiconductor Manufacturing

    Frizzo, Davide, Borsatti, Francesco, SUSTO, GIAN ANTONIO · 2026

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.22828567

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  9. Review Report on Characterization of Integrated Circuits

    N Greeshmanth, Sujatha D Badiger, Pankaj Kumar · 2020 · Journals of Advancement in Electronics Design

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.3896148

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
  10. AN OVERVIEW OF COMPOSITE MATERIALS UNDER THERMAL AND IMPACT LOADING: PROPERTIES AND BEHAVIOUR

    Gaurav Kumar*, Dr. Pardeep Gahlot** & Dr. Rajesh** · 2023 · International Journal of Engineering Research and Modern Education (IJERME)

    limited evidence Transparent signal score 43/100 · policy 1.0.0

    Found in zenodo · DOI 10.5281/zenodo.8217246

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    • cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer