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10 merged results for "Warpage"

Partial results: at least one source did not answer. Available results are shown rather than treating an upstream outage as zero matches.

1. Application of new conformal cooling layouts to the green injection molding of complex slender polymeric parts with high dimensional specifications

   Abelardo Torres Alba, Jorge Manuel Mercado Colmenero, Juan de Dios Caballero Garcia, Cristina Martin Donate · 2025 · (2023). Application of new conformal cooling layouts to the green injection molding of complex slender polymeric parts with high dimensional specifications. Polymers, 15(3), 558

   uncertain Transparent signal score 53/100 · policy 1.0.0

   Found in arxiv · DOI 10.3390/polym15030558

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   • supportingMetadata completeness: All 6 scored descriptive metadata groups are present. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

2. Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

   J. Stopford, A. Henry, D. Allen, N. Bennett · 2012

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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3. Designing High-Performance and Thermally Feasible Multi-Chiplet Architectures enabled by Non-bendable Glass Interposer

   Harsh Sharma, Janardhan Rao Doppa, Umit Y. Ogras, Partha Pratim Pande · 2025

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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4. ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC

   Qipan Wang, Tianxiang Zhu, Tianyu Jia, Yibo Lin · 2025

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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5. Deformation and Stress Evolution during Laser Powder Bed Fusion of Semi-Crystalline Polyamide-12

   Zhongfeng Xu, Wei Zhu, Lionel Freire, Noëlle Billon · 2025 · Additive Manufacturing, 2025

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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6. Uncertainty Analysis of Experimental Parameters for Reducing Warpage in Injection Molding

   Yezhuo Li, Fan Zhang, Dhanashree Shinde, Qiong Zhang · 2026

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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7. WarPGNN: A Parametric Thermal Warpage Analysis Framework with Physics-aware Graph Neural Network

   Haotian Lu, Jincong Lu, Sachin Sachdeva, Sheldon X. -D. Tan · 2026

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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8. WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks

   Xinyu Li, Min Tang, Zeyu Sun, Wenxing Zhu · 2026

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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9. Simplified Swarm Optimization for Surrogate-Assisted Reliability Design of Insulated-Gate Bipolar Transistor Power Modules Using an Open-Source Process Finite-Element Model

   Wei-Chang Yeh · 2026

   uncertain Transparent signal score 58/100 · policy 1.0.0

   Found in arxiv · no DOI

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10. Bezier-GP: Bezier-Surface-Based Gaussian Process for Chips-on-Wafer Warpage Modeling

    Sangyup Lee, Xiao Liu, Jianjun Shi · 2026

    uncertain Transparent signal score 58/100 · policy 1.0.0

    Found in arxiv · no DOI

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