Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.

Takakuwa M, Inoue D, Sun L, Yamamoto M, Umezu S, Hashizume D, Itoh T, Fukuda K, Someya T, Yokota T

DOI: 10.1002/adma.202417590
Published: 2025 Dec
Container: Advanced materials (Deerfield Beach, Fla.)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/adma.202417590,
  title = {Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.},
  author = {Takakuwa M and Inoue D and Sun L and Yamamoto M and Umezu S and Hashizume D and Itoh T and Fukuda K and Someya T and Yokota T},
  year = {2025},
  journal = {Advanced materials (Deerfield Beach, Fla.)},
  doi = {10.1002/adma.202417590},
  url = {https://doi.org/10.1002/adma.202417590}
}

RIS

TY  - JOUR
TI  - Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.
AU  - Takakuwa M
AU  - Inoue D
AU  - Sun L
AU  - Yamamoto M
AU  - Umezu S
AU  - Hashizume D
AU  - Itoh T
AU  - Fukuda K
AU  - Someya T
AU  - Yokota T
PY  - 2025
JO  - Advanced materials (Deerfield Beach, Fla.)
DO  - 10.1002/adma.202417590
UR  - https://doi.org/10.1002/adma.202417590
ER  -

APA

M, T., D, I., L, S., M, Y., S, U., D, H., T, I., K, F., T, S., & T, Y. (2025). Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.. Advanced materials (Deerfield Beach, Fla.). https://doi.org/10.1002/adma.202417590

Source records

pubmed · retrieved 2026-09-26T22:04:29.055Z