Dispersion‐Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On‐Chip Communication

Xinxin Gao, Qian Ma, Ze Gu, Kam‐Man Shum, Bao Jie Chen, Rui Si Li, Wen Yi Cui, Tie Jun Cui, Chi Hou Chan

Open source

DOI
10.1002/adma.202503584
Published
2025-12-26
Container
Advanced Materials
Publisher
Wiley
Open access
unknown

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BibTeX

@article{allodium:10.1002/adma.202503584,
  title = {Dispersion‐Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On‐Chip Communication},
  author = {Xinxin Gao and Qian Ma and Ze Gu and Kam‐Man Shum and Bao Jie Chen and Rui Si Li and Wen Yi Cui and Tie Jun Cui and Chi Hou Chan},
  year = {2025},
  journal = {Advanced Materials},
  doi = {10.1002/adma.202503584},
  url = {https://doi.org/10.1002/adma.202503584}
}

RIS

TY  - JOUR
TI  - Dispersion‐Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On‐Chip Communication
AU  - Xinxin Gao
AU  - Qian Ma
AU  - Ze Gu
AU  - Kam‐Man Shum
AU  - Bao Jie Chen
AU  - Rui Si Li
AU  - Wen Yi Cui
AU  - Tie Jun Cui
AU  - Chi Hou Chan
PY  - 2025
JO  - Advanced Materials
DO  - 10.1002/adma.202503584
UR  - https://doi.org/10.1002/adma.202503584
ER  - 

APA

Gao, X., Ma, Q., Gu, Z., Shum, K., Chen, B. J., Li, R. S., Cui, W. Y., Cui, T. J., & Chan, C. H. (2025). Dispersion‐Engineered Terahertz Spoof Plasmonic Neural Network for Parallel Computing and On‐Chip Communication. Advanced Materials. https://doi.org/10.1002/adma.202503584

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