Microphase Rivet‐Reinforced Interfaces in PTFE Composites: Enabling High Thermal Conductivity and Dimensional Stability for High‐Frequency Substrates

Hanyu Guo, Renke Li, Wei Gao, Yuting Kong, Yongfeng Li, Rong Chen, Hong Wu, Shaoyun Guo

Open source

DOI: 10.1002/adma.73747
Published: 2026-06-19
Container: Advanced Materials
Publisher: Wiley
Open access: unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

supportingDOI registered: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
supportingDOI resolves: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredOpen access status: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
supportingMetadata completeness: All 6 scored descriptive metadata groups are present. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.1002/adma.73747,
  title = {Microphase Rivet‐Reinforced Interfaces in PTFE Composites: Enabling High Thermal Conductivity and Dimensional Stability for High‐Frequency Substrates},
  author = {Hanyu Guo and Renke Li and Wei Gao and Yuting Kong and Yongfeng Li and Rong Chen and Hong Wu and Shaoyun Guo},
  year = {2026},
  journal = {Advanced Materials},
  doi = {10.1002/adma.73747},
  url = {https://doi.org/10.1002/adma.73747}
}

RIS

TY  - JOUR
TI  - Microphase Rivet‐Reinforced Interfaces in PTFE Composites: Enabling High Thermal Conductivity and Dimensional Stability for High‐Frequency Substrates
AU  - Hanyu Guo
AU  - Renke Li
AU  - Wei Gao
AU  - Yuting Kong
AU  - Yongfeng Li
AU  - Rong Chen
AU  - Hong Wu
AU  - Shaoyun Guo
PY  - 2026
JO  - Advanced Materials
DO  - 10.1002/adma.73747
UR  - https://doi.org/10.1002/adma.73747
ER  -

APA

Guo, H., Li, R., Gao, W., Kong, Y., Li, Y., Chen, R., Wu, H., & Guo, S. (2026). Microphase Rivet‐Reinforced Interfaces in PTFE Composites: Enabling High Thermal Conductivity and Dimensional Stability for High‐Frequency Substrates. Advanced Materials. https://doi.org/10.1002/adma.73747

Source records

crossref · retrieved 2026-09-25T15:34:05.140Z