Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering
- DOI
- 10.1002/adma.73894
- Published
- 2026-07-06
- Container
- Advanced Materials
- Publisher
- Wiley
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1002/adma.73894,
title = {Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering},
author = {Jun Shen and Hao Jiang and Jiajing Huang and Haoyu Wang and Zhiteng Wang and Han Zhao and Xiangyu Wang and Hengda Sun and Feng Yan and Hongzhi Wang and Meifang Zhu and Yue Lin and Gang Wang},
year = {2026},
journal = {Advanced Materials},
doi = {10.1002/adma.73894},
url = {https://doi.org/10.1002/adma.73894}
}RIS
TY - JOUR TI - Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering AU - Jun Shen AU - Hao Jiang AU - Jiajing Huang AU - Haoyu Wang AU - Zhiteng Wang AU - Han Zhao AU - Xiangyu Wang AU - Hengda Sun AU - Feng Yan AU - Hongzhi Wang AU - Meifang Zhu AU - Yue Lin AU - Gang Wang PY - 2026 JO - Advanced Materials DO - 10.1002/adma.73894 UR - https://doi.org/10.1002/adma.73894 ER -
APA
Shen, J., Jiang, H., Huang, J., Wang, H., Wang, Z., Zhao, H., Wang, X., Sun, H., Yan, F., Wang, H., Zhu, M., Lin, Y., & Wang, G. (2026). Breaking Thermal Conductivity–Electrical Resistivity Trade‐Off in Liquid Metal–Based Thermal Interface Materials via Interface Engineering. Advanced Materials. https://doi.org/10.1002/adma.73894
Source records
- crossref · retrieved 2026-11-10T08:29:28.877Z