A Device‐to‐Package Perspective on Thermal Management Materials for Electronic Devices

Weikang Li, Yonglin Xia, Xinyu Zhang, Zhongyong Wang, Hua Bao

Open source

DOI: 10.1002/adma.75567
Published: 2026-11-01
Container: Advanced Materials
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/adma.75567,
  title = {A Device‐to‐Package Perspective on Thermal Management Materials for Electronic Devices},
  author = {Weikang Li and Yonglin Xia and Xinyu Zhang and Zhongyong Wang and Hua Bao},
  year = {2026},
  journal = {Advanced Materials},
  doi = {10.1002/adma.75567},
  url = {https://doi.org/10.1002/adma.75567}
}

RIS

TY  - JOUR
TI  - A Device‐to‐Package Perspective on Thermal Management Materials for Electronic Devices
AU  - Weikang Li
AU  - Yonglin Xia
AU  - Xinyu Zhang
AU  - Zhongyong Wang
AU  - Hua Bao
PY  - 2026
JO  - Advanced Materials
DO  - 10.1002/adma.75567
UR  - https://doi.org/10.1002/adma.75567
ER  -

APA

Li, W., Xia, Y., Zhang, X., Wang, Z., & Bao, H. (2026). A Device‐to‐Package Perspective on Thermal Management Materials for Electronic Devices. Advanced Materials. https://doi.org/10.1002/adma.75567

Source records

crossref · retrieved 2026-11-04T13:47:15.920Z