Engineering High‐Performance Flexible Electronics Through Scalable Manufacturing: Interplay of Materials, Processing, and Morphology

Boyue Gao, Yuzhu Li, Yue Wang, Zhitao Zhang

Open source

DOI: 10.1002/adma.75657
Published: 2026-11-06
Container: Advanced Materials
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/adma.75657,
  title = {Engineering High‐Performance Flexible Electronics Through Scalable Manufacturing: Interplay of Materials, Processing, and Morphology},
  author = {Boyue Gao and Yuzhu Li and Yue Wang and Zhitao Zhang},
  year = {2026},
  journal = {Advanced Materials},
  doi = {10.1002/adma.75657},
  url = {https://doi.org/10.1002/adma.75657}
}

RIS

TY  - JOUR
TI  - Engineering High‐Performance Flexible Electronics Through Scalable Manufacturing: Interplay of Materials, Processing, and Morphology
AU  - Boyue Gao
AU  - Yuzhu Li
AU  - Yue Wang
AU  - Zhitao Zhang
PY  - 2026
JO  - Advanced Materials
DO  - 10.1002/adma.75657
UR  - https://doi.org/10.1002/adma.75657
ER  -

APA

Gao, B., Li, Y., Wang, Y., & Zhang, Z. (2026). Engineering High‐Performance Flexible Electronics Through Scalable Manufacturing: Interplay of Materials, Processing, and Morphology. Advanced Materials. https://doi.org/10.1002/adma.75657

Source records

crossref · retrieved 2026-11-07T06:40:20.590Z