Ultra-Tough Copper-Copper Bonding by Nano-Oxide-Dispersed Copper Nanomembranes.

Teng Y, Zhu W, Wang Q, Zhang Z, Wang H, Guo B, Yang Z, Gong H, He C, Qu B, Feng SP, Yang Y

DOI: 10.1002/advs.202408302
Published: 2025 Apr
Container: Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/advs.202408302,
  title = {Ultra-Tough Copper-Copper Bonding by Nano-Oxide-Dispersed Copper Nanomembranes.},
  author = {Teng Y and Zhu W and Wang Q and Zhang Z and Wang H and Guo B and Yang Z and Gong H and He C and Qu B and Feng SP and Yang Y},
  year = {2025},
  journal = {Advanced science (Weinheim, Baden-Wurttemberg, Germany)},
  doi = {10.1002/advs.202408302},
  url = {https://doi.org/10.1002/advs.202408302}
}

RIS

TY  - JOUR
TI  - Ultra-Tough Copper-Copper Bonding by Nano-Oxide-Dispersed Copper Nanomembranes.
AU  - Teng Y
AU  - Zhu W
AU  - Wang Q
AU  - Zhang Z
AU  - Wang H
AU  - Guo B
AU  - Yang Z
AU  - Gong H
AU  - He C
AU  - Qu B
AU  - Feng SP
AU  - Yang Y
PY  - 2025
JO  - Advanced science (Weinheim, Baden-Wurttemberg, Germany)
DO  - 10.1002/advs.202408302
UR  - https://doi.org/10.1002/advs.202408302
ER  -

APA

Y, T., W, Z., Q, W., Z, Z., H, W., B, G., Z, Y., H, G., C, H., B, Q., SP, F., & Y, Y. (2025). Ultra-Tough Copper-Copper Bonding by Nano-Oxide-Dispersed Copper Nanomembranes.. Advanced science (Weinheim, Baden-Wurttemberg, Germany). https://doi.org/10.1002/advs.202408302

Source records

pubmed · retrieved 2026-09-25T16:22:36.720Z