A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications
- DOI
- 10.1002/advs.202417648
- Published
- 2025-08-28
- Container
- Advanced Science
- Publisher
- Wiley
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1002/advs.202417648,
title = {A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications},
author = {Wang Qin and Shujuan Li and Wei Wei and Haiqing Bai and Shikui Jia and Robert G Landers and Yunlong Ma and Sha Wei and Tuo Kang and Miao Zhang and Weipei Zhang and Mingkun Wang and Tongxin Guan},
year = {2025},
journal = {Advanced Science},
doi = {10.1002/advs.202417648},
url = {https://doi.org/10.1002/advs.202417648}
}RIS
TY - JOUR TI - A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications AU - Wang Qin AU - Shujuan Li AU - Wei Wei AU - Haiqing Bai AU - Shikui Jia AU - Robert G Landers AU - Yunlong Ma AU - Sha Wei AU - Tuo Kang AU - Miao Zhang AU - Weipei Zhang AU - Mingkun Wang AU - Tongxin Guan PY - 2025 JO - Advanced Science DO - 10.1002/advs.202417648 UR - https://doi.org/10.1002/advs.202417648 ER -
APA
Qin, W., Li, S., Wei, W., Bai, H., Jia, S., Landers, R. G., Ma, Y., Wei, S., Kang, T., Zhang, M., Zhang, W., Wang, M., & Guan, T. (2025). A 3D Printing Strategy for Hard Curved Surfaced Circuits: From Materials to Applications. Advanced Science. https://doi.org/10.1002/advs.202417648
Source records
- crossref · retrieved 2026-11-05T12:03:15.796Z