Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Huo Y, Song J, Li W, Zhang J, Zhang Y, Fu Y, Yuan W, Chen X, Liu S, Jiang M, Cheng Y, Zhang G.

Open source

DOI: 10.1002/advs.202524348
Published: 2026-02-16
Container: Adv Sci (Weinh)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/advs.202524348,
  title = {Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.},
  author = {Huo Y and  Song J and  Li W and  Zhang J and  Zhang Y and  Fu Y and  Yuan W and  Chen X and  Liu S and  Jiang M and  Cheng Y and  Zhang G.},
  year = {2026},
  journal = {Adv Sci (Weinh)},
  doi = {10.1002/advs.202524348},
  url = {https://doi.org/10.1002/advs.202524348}
}

RIS

TY  - JOUR
TI  - Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.
AU  - Huo Y
AU  -  Song J
AU  -  Li W
AU  -  Zhang J
AU  -  Zhang Y
AU  -  Fu Y
AU  -  Yuan W
AU  -  Chen X
AU  -  Liu S
AU  -  Jiang M
AU  -  Cheng Y
AU  -  Zhang G.
PY  - 2026
JO  - Adv Sci (Weinh)
DO  - 10.1002/advs.202524348
UR  - https://doi.org/10.1002/advs.202524348
ER  -

APA

Y, H., J, S., W, L., J, Z., Y, Z., Y, F., W, Y., X, C., S, L., M, J., Y, C., & G., Z. (2026). Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.. Adv Sci (Weinh). https://doi.org/10.1002/advs.202524348

Source records

europe-pmc · retrieved 2026-09-24T22:45:22.270Z
doaj · retrieved 2026-09-24T22:45:22.291Z