Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

Yongjun Huo, Jiaqi Song, Wenqian Li, Jian Zhang, Yujin Zhang, Yang Fu, Wangchao Yuan, Xin Chen, Sichen Liu, Miao Jiang, Yuan Cheng, Gang Zhang

Open source

DOI: 10.1002/advs.202524348
Published: 2026-02-16
Container: Advanced Science
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/advs.202524348,
  title = {Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics},
  author = {Yongjun Huo and Jiaqi Song and Wenqian Li and Jian Zhang and Yujin Zhang and Yang Fu and Wangchao Yuan and Xin Chen and Sichen Liu and Miao Jiang and Yuan Cheng and Gang Zhang},
  year = {2026},
  journal = {Advanced Science},
  doi = {10.1002/advs.202524348},
  url = {https://doi.org/10.1002/advs.202524348}
}

RIS

TY  - JOUR
TI  - Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
AU  - Yongjun Huo
AU  - Jiaqi Song
AU  - Wenqian Li
AU  - Jian Zhang
AU  - Yujin Zhang
AU  - Yang Fu
AU  - Wangchao Yuan
AU  - Xin Chen
AU  - Sichen Liu
AU  - Miao Jiang
AU  - Yuan Cheng
AU  - Gang Zhang
PY  - 2026
JO  - Advanced Science
DO  - 10.1002/advs.202524348
UR  - https://doi.org/10.1002/advs.202524348
ER  -

APA

Huo, Y., Song, J., Li, W., Zhang, J., Zhang, Y., Fu, Y., Yuan, W., Chen, X., Liu, S., Jiang, M., Cheng, Y., & Zhang, G. (2026). Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics. Advanced Science. https://doi.org/10.1002/advs.202524348

Source records

crossref · retrieved 2026-11-09T07:31:24.538Z