Progress in Strain Engineering of 2D-Integrated Heterostructures for Ultrasensitive Sensors.

Ton TB, Tran TS, Tran DK, Dau VT, Dao DV

Open source

DOI
10.1002/advs.75506
Published
2026 Jun
Container
Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Publisher
Not recorded
Open access
yes

Credibility signals

limited evidence Score 45/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1002/advs.75506,
  title = {Progress in Strain Engineering of 2D-Integrated Heterostructures for Ultrasensitive Sensors.},
  author = {Ton TB and Tran TS and Tran DK and Dau VT and Dao DV},
  year = {2026},
  journal = {Advanced science (Weinheim, Baden-Wurttemberg, Germany)},
  doi = {10.1002/advs.75506},
  url = {https://doi.org/10.1002/advs.75506}
}

RIS

TY  - JOUR
TI  - Progress in Strain Engineering of 2D-Integrated Heterostructures for Ultrasensitive Sensors.
AU  - Ton TB
AU  - Tran TS
AU  - Tran DK
AU  - Dau VT
AU  - Dao DV
PY  - 2026
JO  - Advanced science (Weinheim, Baden-Wurttemberg, Germany)
DO  - 10.1002/advs.75506
UR  - https://doi.org/10.1002/advs.75506
ER  - 

APA

TB, T., TS, T., DK, T., VT, D., & DV, D. (2026). Progress in Strain Engineering of 2D-Integrated Heterostructures for Ultrasensitive Sensors.. Advanced science (Weinheim, Baden-Wurttemberg, Germany). https://doi.org/10.1002/advs.75506

Source records