Pattern‐Aware Intelligence Enables Nondestructive, Rapid Quantification of High‐Aspect‐Ratio Silicon Etching

Shuyan He, Lang Chen, Bo Wen, Yufeng Jin, Wei Wang

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DOI: 10.1002/advs.76723
Published: 2026-07-20
Container: Advanced Science
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/advs.76723,
  title = {Pattern‐Aware Intelligence Enables Nondestructive, Rapid Quantification of High‐Aspect‐Ratio Silicon Etching},
  author = {Shuyan He and Lang Chen and Bo Wen and Yufeng Jin and Wei Wang},
  year = {2026},
  journal = {Advanced Science},
  doi = {10.1002/advs.76723},
  url = {https://doi.org/10.1002/advs.76723}
}

RIS

TY  - JOUR
TI  - Pattern‐Aware Intelligence Enables Nondestructive, Rapid Quantification of High‐Aspect‐Ratio Silicon Etching
AU  - Shuyan He
AU  - Lang Chen
AU  - Bo Wen
AU  - Yufeng Jin
AU  - Wei Wang
PY  - 2026
JO  - Advanced Science
DO  - 10.1002/advs.76723
UR  - https://doi.org/10.1002/advs.76723
ER  -

APA

He, S., Chen, L., Wen, B., Jin, Y., & Wang, W. (2026). Pattern‐Aware Intelligence Enables Nondestructive, Rapid Quantification of High‐Aspect‐Ratio Silicon Etching. Advanced Science. https://doi.org/10.1002/advs.76723

Source records

crossref · retrieved 2026-09-27T07:22:53.519Z