Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy

Jiancheng Chen, Feng Wang, Dongsheng Qian, Huiling Wang, Jinsong Wu, Mingwang Fu, Lin Hua

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DOI: 10.1002/advs.77128
Published: 2026-08-19
Container: Advanced Science
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/advs.77128,
  title = {Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy},
  author = {Jiancheng Chen and Feng Wang and Dongsheng Qian and Huiling Wang and Jinsong Wu and Mingwang Fu and Lin Hua},
  year = {2026},
  journal = {Advanced Science},
  doi = {10.1002/advs.77128},
  url = {https://doi.org/10.1002/advs.77128}
}

RIS

TY  - JOUR
TI  - Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy
AU  - Jiancheng Chen
AU  - Feng Wang
AU  - Dongsheng Qian
AU  - Huiling Wang
AU  - Jinsong Wu
AU  - Mingwang Fu
AU  - Lin Hua
PY  - 2026
JO  - Advanced Science
DO  - 10.1002/advs.77128
UR  - https://doi.org/10.1002/advs.77128
ER  -

APA

Chen, J., Wang, F., Qian, D., Wang, H., Wu, J., Fu, M., & Hua, L. (2026). Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy. Advanced Science. https://doi.org/10.1002/advs.77128

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crossref · retrieved 2026-11-10T06:48:20.268Z