Wafer-Scale 3D Integration for High-Density Multi-Valued Neuromorphic Logic.

Kim CH, Kim MS, Rhim JB, Kim TI, Kwon HI, Park IJ

DOI: 10.1002/advs.77437
Published: 2026 Aug 25
Container: Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/advs.77437,
  title = {Wafer-Scale 3D Integration for High-Density Multi-Valued Neuromorphic Logic.},
  author = {Kim CH and Kim MS and Rhim JB and Kim TI and Kwon HI and Park IJ},
  year = {2026},
  journal = {Advanced science (Weinheim, Baden-Wurttemberg, Germany)},
  doi = {10.1002/advs.77437},
  url = {https://doi.org/10.1002/advs.77437}
}

RIS

TY  - JOUR
TI  - Wafer-Scale 3D Integration for High-Density Multi-Valued Neuromorphic Logic.
AU  - Kim CH
AU  - Kim MS
AU  - Rhim JB
AU  - Kim TI
AU  - Kwon HI
AU  - Park IJ
PY  - 2026
JO  - Advanced science (Weinheim, Baden-Wurttemberg, Germany)
DO  - 10.1002/advs.77437
UR  - https://doi.org/10.1002/advs.77437
ER  -

APA

CH, K., MS, K., JB, R., TI, K., HI, K., & IJ, P. (2026). Wafer-Scale 3D Integration for High-Density Multi-Valued Neuromorphic Logic.. Advanced science (Weinheim, Baden-Wurttemberg, Germany). https://doi.org/10.1002/advs.77437

Source records

pubmed · retrieved 2026-09-24T21:35:01.948Z