A Scalable Double-Sided Wet Etching Strategy for Large-Area Mushroom-Shaped Bionic Adhesives.

Ji K, Xu X, Chen J, Chen W, Zhu X, Ma H, Jiang X, Linghu C, Dai Z

DOI: 10.1002/advs.77709
Published: 2026 Sep 11
Container: Advanced science (Weinheim, Baden-Wurttemberg, Germany)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/advs.77709,
  title = {A Scalable Double-Sided Wet Etching Strategy for Large-Area Mushroom-Shaped Bionic Adhesives.},
  author = {Ji K and Xu X and Chen J and Chen W and Zhu X and Ma H and Jiang X and Linghu C and Dai Z},
  year = {2026},
  journal = {Advanced science (Weinheim, Baden-Wurttemberg, Germany)},
  doi = {10.1002/advs.77709},
  url = {https://doi.org/10.1002/advs.77709}
}

RIS

TY  - JOUR
TI  - A Scalable Double-Sided Wet Etching Strategy for Large-Area Mushroom-Shaped Bionic Adhesives.
AU  - Ji K
AU  - Xu X
AU  - Chen J
AU  - Chen W
AU  - Zhu X
AU  - Ma H
AU  - Jiang X
AU  - Linghu C
AU  - Dai Z
PY  - 2026
JO  - Advanced science (Weinheim, Baden-Wurttemberg, Germany)
DO  - 10.1002/advs.77709
UR  - https://doi.org/10.1002/advs.77709
ER  -

APA

K, J., X, X., J, C., W, C., X, Z., H, M., X, J., C, L., & Z, D. (2026). A Scalable Double-Sided Wet Etching Strategy for Large-Area Mushroom-Shaped Bionic Adhesives.. Advanced science (Weinheim, Baden-Wurttemberg, Germany). https://doi.org/10.1002/advs.77709

Source records

pubmed · retrieved 2026-09-25T21:54:47.914Z