Sandwich-Structured Aramid Composite Papers with Heterogeneous Dielectric Layers for Integrated Corona Resistance and Thermal Conductivity.

Ren JW, Chen JX, Tong YY, Wang Z, Zhang JC, Zhang L, Zhang B, Zhang F, Wang GL, Zha JW, Jia SL.

DOI: 10.1002/advs.77937
Published: 2026-10-14
Container: Adv Sci (Weinh)
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1002/advs.77937,
  title = {Sandwich-Structured Aramid Composite Papers with Heterogeneous Dielectric Layers for Integrated Corona Resistance and Thermal Conductivity.},
  author = {Ren JW and  Chen JX and  Tong YY and  Wang Z and  Zhang JC and  Zhang L and  Zhang B and  Zhang F and  Wang GL and  Zha JW and  Jia SL.},
  year = {2026},
  journal = {Adv Sci (Weinh)},
  doi = {10.1002/advs.77937},
  url = {https://doi.org/10.1002/advs.77937}
}

RIS

TY  - JOUR
TI  - Sandwich-Structured Aramid Composite Papers with Heterogeneous Dielectric Layers for Integrated Corona Resistance and Thermal Conductivity.
AU  - Ren JW
AU  -  Chen JX
AU  -  Tong YY
AU  -  Wang Z
AU  -  Zhang JC
AU  -  Zhang L
AU  -  Zhang B
AU  -  Zhang F
AU  -  Wang GL
AU  -  Zha JW
AU  -  Jia SL.
PY  - 2026
JO  - Adv Sci (Weinh)
DO  - 10.1002/advs.77937
UR  - https://doi.org/10.1002/advs.77937
ER  -

APA

JW, R., JX, C., YY, T., Z, W., JC, Z., L, Z., B, Z., F, Z., GL, W., JW, Z., & SL., J. (2026). Sandwich-Structured Aramid Composite Papers with Heterogeneous Dielectric Layers for Integrated Corona Resistance and Thermal Conductivity.. Adv Sci (Weinh). https://doi.org/10.1002/advs.77937

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europe-pmc · retrieved 2026-11-10T06:39:44.747Z