Reprocessable, Creep-Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging.

Yao H, Jing C, Dong A, Li Y, Fei X, Zhang J, Ma J, Cheng J

DOI: 10.1002/anie.1898181
Published: 2026 Sep 16
Container: Angewandte Chemie (International ed. in English)
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1002/anie.1898181,
  title = {Reprocessable, Creep-Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging.},
  author = {Yao H and Jing C and Dong A and Li Y and Fei X and Zhang J and Ma J and Cheng J},
  year = {2026},
  journal = {Angewandte Chemie (International ed. in English)},
  doi = {10.1002/anie.1898181},
  url = {https://doi.org/10.1002/anie.1898181}
}

RIS

TY  - JOUR
TI  - Reprocessable, Creep-Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging.
AU  - Yao H
AU  - Jing C
AU  - Dong A
AU  - Li Y
AU  - Fei X
AU  - Zhang J
AU  - Ma J
AU  - Cheng J
PY  - 2026
JO  - Angewandte Chemie (International ed. in English)
DO  - 10.1002/anie.1898181
UR  - https://doi.org/10.1002/anie.1898181
ER  -

APA

H, Y., C, J., A, D., Y, L., X, F., J, Z., J, M., & J, C. (2026). Reprocessable, Creep-Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging.. Angewandte Chemie (International ed. in English). https://doi.org/10.1002/anie.1898181

Source records

pubmed · retrieved 2026-09-25T07:15:41.344Z
europe-pmc · retrieved 2026-09-25T07:15:41.328Z