Solvent Hydrogen Bonding Determines Adsorption Geometry of Trimesic Acid on Cu.

Lalitha A, Li Q, Sulpizi M, Andrienko D, Domke KF

DOI: 10.1002/anie.3523377
Published: 2026 Sep 21
Container: Angewandte Chemie (International ed. in English)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/anie.3523377,
  title = {Solvent Hydrogen Bonding Determines Adsorption Geometry of Trimesic Acid on Cu.},
  author = {Lalitha A and Li Q and Sulpizi M and Andrienko D and Domke KF},
  year = {2026},
  journal = {Angewandte Chemie (International ed. in English)},
  doi = {10.1002/anie.3523377},
  url = {https://doi.org/10.1002/anie.3523377}
}

RIS

TY  - JOUR
TI  - Solvent Hydrogen Bonding Determines Adsorption Geometry of Trimesic Acid on Cu.
AU  - Lalitha A
AU  - Li Q
AU  - Sulpizi M
AU  - Andrienko D
AU  - Domke KF
PY  - 2026
JO  - Angewandte Chemie (International ed. in English)
DO  - 10.1002/anie.3523377
UR  - https://doi.org/10.1002/anie.3523377
ER  -

APA

A, L., Q, L., M, S., D, A., & KF, D. (2026). Solvent Hydrogen Bonding Determines Adsorption Geometry of Trimesic Acid on Cu.. Angewandte Chemie (International ed. in English). https://doi.org/10.1002/anie.3523377

Source records

pubmed · retrieved 2026-09-26T13:23:47.223Z