Beyond Physical Protection Paradigm: Surface-bonded Molecular Integration for Durable High-voltage LiCoO(2).

Xie T, Liu W, Cheng J, Jiang Y, Yuan R, Fan J, Peng D, Zheng M, Dong Q

DOI: 10.1002/anie.5600863
Published: 2026 Sep 21
Container: Angewandte Chemie (International ed. in English)
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/anie.5600863,
  title = {Beyond Physical Protection Paradigm: Surface-bonded Molecular Integration for Durable High-voltage LiCoO(2).},
  author = {Xie T and Liu W and Cheng J and Jiang Y and Yuan R and Fan J and Peng D and Zheng M and Dong Q},
  year = {2026},
  journal = {Angewandte Chemie (International ed. in English)},
  doi = {10.1002/anie.5600863},
  url = {https://doi.org/10.1002/anie.5600863}
}

RIS

TY  - JOUR
TI  - Beyond Physical Protection Paradigm: Surface-bonded Molecular Integration for Durable High-voltage LiCoO(2).
AU  - Xie T
AU  - Liu W
AU  - Cheng J
AU  - Jiang Y
AU  - Yuan R
AU  - Fan J
AU  - Peng D
AU  - Zheng M
AU  - Dong Q
PY  - 2026
JO  - Angewandte Chemie (International ed. in English)
DO  - 10.1002/anie.5600863
UR  - https://doi.org/10.1002/anie.5600863
ER  -

APA

T, X., W, L., J, C., Y, J., R, Y., J, F., D, P., M, Z., & Q, D. (2026). Beyond Physical Protection Paradigm: Surface-bonded Molecular Integration for Durable High-voltage LiCoO(2).. Angewandte Chemie (International ed. in English). https://doi.org/10.1002/anie.5600863

Source records

pubmed · retrieved 2026-09-25T01:45:12.007Z