Rapid assessment of fern spore quality using microscale electrical conductivity testing

Yao‐Moan Huang, Chia‐Wen Ko, Chin‐Tzer Duh, Chu‐Mei Huang, Wen‐Liang Chiou, Tzu‐Tong Kao

Open source

DOI
10.1002/aps3.70078
Published
2026-09-09
Container
Applications in Plant Sciences
Publisher
Wiley
Open access
unknown

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BibTeX

@article{allodium:10.1002/aps3.70078,
  title = {Rapid assessment of fern spore quality using microscale electrical conductivity testing},
  author = {Yao‐Moan Huang and Chia‐Wen Ko and Chin‐Tzer Duh and Chu‐Mei Huang and Wen‐Liang Chiou and Tzu‐Tong Kao},
  year = {2026},
  journal = {Applications in Plant Sciences},
  doi = {10.1002/aps3.70078},
  url = {https://doi.org/10.1002/aps3.70078}
}

RIS

TY  - JOUR
TI  - Rapid assessment of fern spore quality using microscale electrical conductivity testing
AU  - Yao‐Moan Huang
AU  - Chia‐Wen Ko
AU  - Chin‐Tzer Duh
AU  - Chu‐Mei Huang
AU  - Wen‐Liang Chiou
AU  - Tzu‐Tong Kao
PY  - 2026
JO  - Applications in Plant Sciences
DO  - 10.1002/aps3.70078
UR  - https://doi.org/10.1002/aps3.70078
ER  - 

APA

Huang, Y., Ko, C., Duh, C., Huang, C., Chiou, W., & Kao, T. (2026). Rapid assessment of fern spore quality using microscale electrical conductivity testing. Applications in Plant Sciences. https://doi.org/10.1002/aps3.70078

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