3D Hierarchical Cu Nanowire Scaffolds with Rest-Free Symmetric Pulsed Plating/Stripping for Stable Lithium-Metal Anodes.

Choi Y, Park E, Lee K

DOI: 10.1002/cssc.202501864
Published: 2026 Jan
Container: ChemSusChem
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/cssc.202501864,
  title = {3D Hierarchical Cu Nanowire Scaffolds with Rest-Free Symmetric Pulsed Plating/Stripping for Stable Lithium-Metal Anodes.},
  author = {Choi Y and Park E and Lee K},
  year = {2026},
  journal = {ChemSusChem},
  doi = {10.1002/cssc.202501864},
  url = {https://doi.org/10.1002/cssc.202501864}
}

RIS

TY  - JOUR
TI  - 3D Hierarchical Cu Nanowire Scaffolds with Rest-Free Symmetric Pulsed Plating/Stripping for Stable Lithium-Metal Anodes.
AU  - Choi Y
AU  - Park E
AU  - Lee K
PY  - 2026
JO  - ChemSusChem
DO  - 10.1002/cssc.202501864
UR  - https://doi.org/10.1002/cssc.202501864
ER  -

APA

Y, C., E, P., & K, L. (2026). 3D Hierarchical Cu Nanowire Scaffolds with Rest-Free Symmetric Pulsed Plating/Stripping for Stable Lithium-Metal Anodes.. ChemSusChem. https://doi.org/10.1002/cssc.202501864

Source records

pubmed · retrieved 2026-09-25T13:34:14.869Z