Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry

Yan Zhang, Hua‐Xin Chen, Li Duan, Lei Ni, Ji‐Bin Fan, Zhuo Wang, Vincent Ji

Open source

DOI
10.1002/sia.6648
Published
2019-04-26
Container
Surface and Interface Analysis
Publisher
Wiley
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1002/sia.6648,
  title = {Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry},
  author = {Yan Zhang and Hua‐Xin Chen and Li Duan and Lei Ni and Ji‐Bin Fan and Zhuo Wang and Vincent Ji},
  year = {2019},
  journal = {Surface and Interface Analysis},
  doi = {10.1002/sia.6648},
  url = {https://doi.org/10.1002/sia.6648}
}

RIS

TY  - JOUR
TI  - Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry
AU  - Yan Zhang
AU  - Hua‐Xin Chen
AU  - Li Duan
AU  - Lei Ni
AU  - Ji‐Bin Fan
AU  - Zhuo Wang
AU  - Vincent Ji
PY  - 2019
JO  - Surface and Interface Analysis
DO  - 10.1002/sia.6648
UR  - https://doi.org/10.1002/sia.6648
ER  - 

APA

Zhang, Y., Chen, H., Duan, L., Ni, L., Fan, J., Wang, Z., & Ji, V. (2019). Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry. Surface and Interface Analysis. https://doi.org/10.1002/sia.6648

Source records