Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry
- DOI
- 10.1002/sia.6648
- Published
- 2019-04-26
- Container
- Surface and Interface Analysis
- Publisher
- Wiley
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1002/sia.6648,
title = {Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry},
author = {Yan Zhang and Hua‐Xin Chen and Li Duan and Lei Ni and Ji‐Bin Fan and Zhuo Wang and Vincent Ji},
year = {2019},
journal = {Surface and Interface Analysis},
doi = {10.1002/sia.6648},
url = {https://doi.org/10.1002/sia.6648}
}RIS
TY - JOUR TI - Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry AU - Yan Zhang AU - Hua‐Xin Chen AU - Li Duan AU - Lei Ni AU - Ji‐Bin Fan AU - Zhuo Wang AU - Vincent Ji PY - 2019 JO - Surface and Interface Analysis DO - 10.1002/sia.6648 UR - https://doi.org/10.1002/sia.6648 ER -
APA
Zhang, Y., Chen, H., Duan, L., Ni, L., Fan, J., Wang, Z., & Ji, V. (2019). Prediction of the terminations and Miller planes of the tetragonal zirconia thin films as a gate dielectric layer in integrated‐circuit industry. Surface and Interface Analysis. https://doi.org/10.1002/sia.6648
Source records
- crossref · retrieved 2026-09-24T23:29:03.752Z