Dual Surface Architectonics for Directed Self-Assembly of Ultrahigh-Resolution Electronics.

Li L, Li W, Sun Q, Liu X, Jiu J, Tenjimbayashi M, Kanehara M, Nakayama T, Minari T

Open source

DOI
10.1002/smll.202101754
Published
2021 Jul
Container
Small (Weinheim an der Bergstrasse, Germany)
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1002/smll.202101754,
  title = {Dual Surface Architectonics for Directed Self-Assembly of Ultrahigh-Resolution Electronics.},
  author = {Li L and Li W and Sun Q and Liu X and Jiu J and Tenjimbayashi M and Kanehara M and Nakayama T and Minari T},
  year = {2021},
  journal = {Small (Weinheim an der Bergstrasse, Germany)},
  doi = {10.1002/smll.202101754},
  url = {https://doi.org/10.1002/smll.202101754}
}

RIS

TY  - JOUR
TI  - Dual Surface Architectonics for Directed Self-Assembly of Ultrahigh-Resolution Electronics.
AU  - Li L
AU  - Li W
AU  - Sun Q
AU  - Liu X
AU  - Jiu J
AU  - Tenjimbayashi M
AU  - Kanehara M
AU  - Nakayama T
AU  - Minari T
PY  - 2021
JO  - Small (Weinheim an der Bergstrasse, Germany)
DO  - 10.1002/smll.202101754
UR  - https://doi.org/10.1002/smll.202101754
ER  - 

APA

L, L., W, L., Q, S., X, L., J, J., M, T., M, K., T, N., & T, M. (2021). Dual Surface Architectonics for Directed Self-Assembly of Ultrahigh-Resolution Electronics.. Small (Weinheim an der Bergstrasse, Germany). https://doi.org/10.1002/smll.202101754

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