Stress Engineering in Flexible Thermoelectrics.

Kennedy C, Murmu PP, Shi XL, Tang L, Mori T, Kennedy JV

DOI: 10.1002/smll.202513473
Published: 2026 Mar
Container: Small (Weinheim an der Bergstrasse, Germany)
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/smll.202513473,
  title = {Stress Engineering in Flexible Thermoelectrics.},
  author = {Kennedy C and Murmu PP and Shi XL and Tang L and Mori T and Kennedy JV},
  year = {2026},
  journal = {Small (Weinheim an der Bergstrasse, Germany)},
  doi = {10.1002/smll.202513473},
  url = {https://doi.org/10.1002/smll.202513473}
}

RIS

TY  - JOUR
TI  - Stress Engineering in Flexible Thermoelectrics.
AU  - Kennedy C
AU  - Murmu PP
AU  - Shi XL
AU  - Tang L
AU  - Mori T
AU  - Kennedy JV
PY  - 2026
JO  - Small (Weinheim an der Bergstrasse, Germany)
DO  - 10.1002/smll.202513473
UR  - https://doi.org/10.1002/smll.202513473
ER  -

APA

C, K., PP, M., XL, S., L, T., T, M., & JV, K. (2026). Stress Engineering in Flexible Thermoelectrics.. Small (Weinheim an der Bergstrasse, Germany). https://doi.org/10.1002/smll.202513473

Source records

pubmed · retrieved 2026-09-26T17:54:25.557Z