Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al <sub>2</sub> O <sub>3</sub> /Epoxy Composites

Yeonwook Jeong, Sabina Ghorsaine, Chan‐Jae Lee, In Kim, Mooho Lee, Hyejeong Lee, Ginam Kim, Jong‐Woong Kim

Open source

DOI
10.1002/smll.75261
Published
2026-08-18
Container
Small
Publisher
Wiley
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1002/smll.75261,
  title = {Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al
                    <sub>2</sub>
                    O
                    <sub>3</sub>
                    /Epoxy Composites},
  author = {Yeonwook Jeong and Sabina Ghorsaine and Chan‐Jae Lee and In Kim and Mooho Lee and Hyejeong Lee and Ginam Kim and Jong‐Woong Kim},
  year = {2026},
  journal = {Small},
  doi = {10.1002/smll.75261},
  url = {https://doi.org/10.1002/smll.75261}
}

RIS

TY  - JOUR
TI  - Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al
                    <sub>2</sub>
                    O
                    <sub>3</sub>
                    /Epoxy Composites
AU  - Yeonwook Jeong
AU  - Sabina Ghorsaine
AU  - Chan‐Jae Lee
AU  - In Kim
AU  - Mooho Lee
AU  - Hyejeong Lee
AU  - Ginam Kim
AU  - Jong‐Woong Kim
PY  - 2026
JO  - Small
DO  - 10.1002/smll.75261
UR  - https://doi.org/10.1002/smll.75261
ER  - 

APA

Jeong, Y., Ghorsaine, S., Lee, C., Kim, I., Lee, M., Lee, H., Kim, G., & Kim, J. (2026). Mitigating Contact‐Constricted Thermal Bottlenecks by Magnetically Programmable hBN Bridge Fillers in Al <sub>2</sub> O <sub>3</sub> /Epoxy Composites. Small. https://doi.org/10.1002/smll.75261

Source records