Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management

Longfeng Zou, Yucheng Jiang, Taoying Rao, Siying He, Long Teng, Yilan Guo, Pengli Zhu, Yimin Yao

Open source

DOI: 10.1002/smll.76290
Published: 2026-10-15
Container: Small
Publisher: Wiley
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/smll.76290,
  title = {Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management},
  author = {Longfeng Zou and Yucheng Jiang and Taoying Rao and Siying He and Long Teng and Yilan Guo and Pengli Zhu and Yimin Yao},
  year = {2026},
  journal = {Small},
  doi = {10.1002/smll.76290},
  url = {https://doi.org/10.1002/smll.76290}
}

RIS

TY  - JOUR
TI  - Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management
AU  - Longfeng Zou
AU  - Yucheng Jiang
AU  - Taoying Rao
AU  - Siying He
AU  - Long Teng
AU  - Yilan Guo
AU  - Pengli Zhu
AU  - Yimin Yao
PY  - 2026
JO  - Small
DO  - 10.1002/smll.76290
UR  - https://doi.org/10.1002/smll.76290
ER  -

APA

Zou, L., Jiang, Y., Rao, T., He, S., Teng, L., Guo, Y., Zhu, P., & Yao, Y. (2026). Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management. Small. https://doi.org/10.1002/smll.76290

Source records

crossref · retrieved 2026-11-10T01:55:09.235Z