Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.

Zhang Y, Xu G, Nozariasbmarz A, Li W, Raman L, Xing C, Sharma S, Liu N, Ghosh S, Joshi G, Sanghadasa M, Shashank P, Poudel B

Open source

DOI: 10.1002/smsc.202300245
Published: 2024 Feb
Container: Small science
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/smsc.202300245,
  title = {Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.},
  author = {Zhang Y and Xu G and Nozariasbmarz A and Li W and Raman L and Xing C and Sharma S and Liu N and Ghosh S and Joshi G and Sanghadasa M and Shashank P and Poudel B},
  year = {2024},
  journal = {Small science},
  doi = {10.1002/smsc.202300245},
  url = {https://doi.org/10.1002/smsc.202300245}
}

RIS

TY  - JOUR
TI  - Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.
AU  - Zhang Y
AU  - Xu G
AU  - Nozariasbmarz A
AU  - Li W
AU  - Raman L
AU  - Xing C
AU  - Sharma S
AU  - Liu N
AU  - Ghosh S
AU  - Joshi G
AU  - Sanghadasa M
AU  - Shashank P
AU  - Poudel B
PY  - 2024
JO  - Small science
DO  - 10.1002/smsc.202300245
UR  - https://doi.org/10.1002/smsc.202300245
ER  -

APA

Y, Z., G, X., A, N., W, L., L, R., C, X., S, S., N, L., S, G., G, J., M, S., P, S., & B, P. (2024). Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.. Small science. https://doi.org/10.1002/smsc.202300245

Source records

pubmed · retrieved 2026-09-26T15:46:42.748Z