Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
- DOI
- 10.1002/smtd.202500831
- Published
- 2025-07-21
- Container
- Small Methods
- Publisher
- Wiley
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1002/smtd.202500831,
title = {Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets},
author = {Cong Chen and Helios Y. Li and Gangqiang Peng and Zeyang Zheng and Erqian Dong and Jianwen Zhong and Chuan He and Yi Wang and Jia‐Syuan Chang and Zhuofei Gan and Jinwei Gao and Yu‐Ting Huang and Chih‐Ming Chen and Shien‐Ping Feng},
year = {2025},
journal = {Small Methods},
doi = {10.1002/smtd.202500831},
url = {https://doi.org/10.1002/smtd.202500831}
}RIS
TY - JOUR TI - Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets AU - Cong Chen AU - Helios Y. Li AU - Gangqiang Peng AU - Zeyang Zheng AU - Erqian Dong AU - Jianwen Zhong AU - Chuan He AU - Yi Wang AU - Jia‐Syuan Chang AU - Zhuofei Gan AU - Jinwei Gao AU - Yu‐Ting Huang AU - Chih‐Ming Chen AU - Shien‐Ping Feng PY - 2025 JO - Small Methods DO - 10.1002/smtd.202500831 UR - https://doi.org/10.1002/smtd.202500831 ER -
APA
Chen, C., Li, H. Y., Peng, G., Zheng, Z., Dong, E., Zhong, J., He, C., Wang, Y., Chang, J., Gan, Z., Gao, J., Huang, Y., Chen, C., & Feng, S. (2025). Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets. Small Methods. https://doi.org/10.1002/smtd.202500831
Source records
- crossref · retrieved 2026-09-25T10:25:38.348Z