Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets.
- DOI
- 10.1002/smtd.202500831
- Published
- 2025 Sep
- Container
- Small methods
- Publisher
- Not recorded
- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.1002/smtd.202500831,
title = {Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets.},
author = {Chen C and Li HY and Peng G and Zheng Z and Dong E and Zhong J and He C and Wang Y and Chang JS and Gan Z and Gao J and Huang YT and Chen CM and Feng SP},
year = {2025},
journal = {Small methods},
doi = {10.1002/smtd.202500831},
url = {https://doi.org/10.1002/smtd.202500831}
}RIS
TY - JOUR TI - Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets. AU - Chen C AU - Li HY AU - Peng G AU - Zheng Z AU - Dong E AU - Zhong J AU - He C AU - Wang Y AU - Chang JS AU - Gan Z AU - Gao J AU - Huang YT AU - Chen CM AU - Feng SP PY - 2025 JO - Small methods DO - 10.1002/smtd.202500831 UR - https://doi.org/10.1002/smtd.202500831 ER -
APA
C, C., HY, L., G, P., Z, Z., E, D., J, Z., C, H., Y, W., JS, C., Z, G., J, G., YT, H., CM, C., & SP, F. (2025). Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets.. Small methods. https://doi.org/10.1002/smtd.202500831
Source records
- pubmed · retrieved 2026-11-10T11:40:01.188Z
- europe-pmc · retrieved 2026-11-10T11:40:01.196Z