Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal Conductance Trade-Off.

Wu H, Cheng G, Liu Q, Wang P, Li M, Jia Q, An Z, Zhang J

DOI: 10.1002/smtd.70789
Published: 2026 Jul
Container: Small methods
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1002/smtd.70789,
  title = {Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal Conductance Trade-Off.},
  author = {Wu H and Cheng G and Liu Q and Wang P and Li M and Jia Q and An Z and Zhang J},
  year = {2026},
  journal = {Small methods},
  doi = {10.1002/smtd.70789},
  url = {https://doi.org/10.1002/smtd.70789}
}

RIS

TY  - JOUR
TI  - Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal Conductance Trade-Off.
AU  - Wu H
AU  - Cheng G
AU  - Liu Q
AU  - Wang P
AU  - Li M
AU  - Jia Q
AU  - An Z
AU  - Zhang J
PY  - 2026
JO  - Small methods
DO  - 10.1002/smtd.70789
UR  - https://doi.org/10.1002/smtd.70789
ER  -

APA

H, W., G, C., Q, L., P, W., M, L., Q, J., Z, A., & J, Z. (2026). Dielectric-Conductive Dual-Shell Structure Design Overcome the Lightweight-High Strength and Electrical-Thermal Conductance Trade-Off.. Small methods. https://doi.org/10.1002/smtd.70789

Source records

pubmed · retrieved 2026-09-26T09:10:52.402Z