Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering
- DOI
- 10.1002/smtd.70836
- Published
- 2026-07-09
- Container
- Small Methods
- Publisher
- Wiley
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1002/smtd.70836,
title = {Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering},
author = {Denis Rocha and Pedro Lopes and Paulo Peixoto and Aníbal de Almeida and Mahmoud Tavakoli},
year = {2026},
journal = {Small Methods},
doi = {10.1002/smtd.70836},
url = {https://doi.org/10.1002/smtd.70836}
}RIS
TY - JOUR TI - Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering AU - Denis Rocha AU - Pedro Lopes AU - Paulo Peixoto AU - Aníbal de Almeida AU - Mahmoud Tavakoli PY - 2026 JO - Small Methods DO - 10.1002/smtd.70836 UR - https://doi.org/10.1002/smtd.70836 ER -
APA
Rocha, D., Lopes, P., Peixoto, P., Almeida, A. D., & Tavakoli, M. (2026). Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering. Small Methods. https://doi.org/10.1002/smtd.70836
Source records
- crossref · retrieved 2026-09-26T02:01:52.602Z