Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering

Denis Rocha, Pedro Lopes, Paulo Peixoto, Aníbal de Almeida, Mahmoud Tavakoli

Open source

DOI
10.1002/smtd.70836
Published
2026-07-09
Container
Small Methods
Publisher
Wiley
Open access
unknown

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BibTeX

@article{allodium:10.1002/smtd.70836,
  title = {Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering},
  author = {Denis Rocha and Pedro Lopes and Paulo Peixoto and Aníbal de Almeida and Mahmoud Tavakoli},
  year = {2026},
  journal = {Small Methods},
  doi = {10.1002/smtd.70836},
  url = {https://doi.org/10.1002/smtd.70836}
}

RIS

TY  - JOUR
TI  - Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering
AU  - Denis Rocha
AU  - Pedro Lopes
AU  - Paulo Peixoto
AU  - Aníbal de Almeida
AU  - Mahmoud Tavakoli
PY  - 2026
JO  - Small Methods
DO  - 10.1002/smtd.70836
UR  - https://doi.org/10.1002/smtd.70836
ER  - 

APA

Rocha, D., Lopes, P., Peixoto, P., Almeida, A. D., & Tavakoli, M. (2026). Multilayer Soft PCBs via Laser Patterning and Solvent‐Assisted Interface Engineering. Small Methods. https://doi.org/10.1002/smtd.70836

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