Transposons as Tools for Future Genome Engineering in Yeasts and Filamentous Fungi.

Peng B, Tominaga M, Wang C, Speight RE, Ishii J

DOI: 10.1002/yea.70036
Published: 2026 Jul 13
Container: Yeast (Chichester, England)
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1002/yea.70036,
  title = {Transposons as Tools for Future Genome Engineering in Yeasts and Filamentous Fungi.},
  author = {Peng B and Tominaga M and Wang C and Speight RE and Ishii J},
  year = {2026},
  journal = {Yeast (Chichester, England)},
  doi = {10.1002/yea.70036},
  url = {https://doi.org/10.1002/yea.70036}
}

RIS

TY  - JOUR
TI  - Transposons as Tools for Future Genome Engineering in Yeasts and Filamentous Fungi.
AU  - Peng B
AU  - Tominaga M
AU  - Wang C
AU  - Speight RE
AU  - Ishii J
PY  - 2026
JO  - Yeast (Chichester, England)
DO  - 10.1002/yea.70036
UR  - https://doi.org/10.1002/yea.70036
ER  -

APA

B, P., M, T., C, W., RE, S., & J, I. (2026). Transposons as Tools for Future Genome Engineering in Yeasts and Filamentous Fungi.. Yeast (Chichester, England). https://doi.org/10.1002/yea.70036

Source records

pubmed · retrieved 2026-09-26T12:42:16.376Z