Reduction of Bubble-Induced Defect in Semiconductor Lithography Process
- DOI
- 10.1007/978-3-031-42532-5_38
- Published
- 2023
- Container
- IFIP Advances in Information and Communication Technology
- Publisher
- Springer Nature Switzerland
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1007/978-3-031-42532-5_38,
title = {Reduction of Bubble-Induced Defect in Semiconductor Lithography Process},
author = {Kyoung-Whan Oh and Takashi Sasa and Seok Heo and Daejung Kim and Ouiserg Kim and Jung-Hyeon Kim},
year = {2023},
journal = {IFIP Advances in Information and Communication Technology},
doi = {10.1007/978-3-031-42532-5_38},
url = {https://doi.org/10.1007/978-3-031-42532-5_38}
}RIS
TY - JOUR TI - Reduction of Bubble-Induced Defect in Semiconductor Lithography Process AU - Kyoung-Whan Oh AU - Takashi Sasa AU - Seok Heo AU - Daejung Kim AU - Ouiserg Kim AU - Jung-Hyeon Kim PY - 2023 JO - IFIP Advances in Information and Communication Technology DO - 10.1007/978-3-031-42532-5_38 UR - https://doi.org/10.1007/978-3-031-42532-5_38 ER -
APA
Oh, K., Sasa, T., Heo, S., Kim, D., Kim, O., & Kim, J. (2023). Reduction of Bubble-Induced Defect in Semiconductor Lithography Process. IFIP Advances in Information and Communication Technology. https://doi.org/10.1007/978-3-031-42532-5_38
Source records
- crossref · retrieved 2026-11-07T16:19:53.705Z