A Haptic Tele-operated System for Microassembly
- DOI
- 10.1007/978-3-642-11598-1_2
- Published
- 2010
- Container
- IFIP Advances in Information and Communication Technology
- Publisher
- Springer Berlin Heidelberg
- Open access
- unknown
Credibility signals
uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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Cite this work
BibTeX
@article{allodium:10.1007/978-3-642-11598-1_2,
title = {A Haptic Tele-operated System for Microassembly},
author = {P. Estevez and S. Khan and P. Lambert and M. Porta and I. Polat and C. Scherer and M. Tichem and U. Staufer and H. H. Langen and R. Munnig Schmidt},
year = {2010},
journal = {IFIP Advances in Information and Communication Technology},
doi = {10.1007/978-3-642-11598-1_2},
url = {https://doi.org/10.1007/978-3-642-11598-1_2}
}RIS
TY - JOUR TI - A Haptic Tele-operated System for Microassembly AU - P. Estevez AU - S. Khan AU - P. Lambert AU - M. Porta AU - I. Polat AU - C. Scherer AU - M. Tichem AU - U. Staufer AU - H. H. Langen AU - R. Munnig Schmidt PY - 2010 JO - IFIP Advances in Information and Communication Technology DO - 10.1007/978-3-642-11598-1_2 UR - https://doi.org/10.1007/978-3-642-11598-1_2 ER -
APA
Estevez, P., Khan, S., Lambert, P., Porta, M., Polat, I., Scherer, C., Tichem, M., Staufer, U., Langen, H. H., & Schmidt, R. M. (2010). A Haptic Tele-operated System for Microassembly. IFIP Advances in Information and Communication Technology. https://doi.org/10.1007/978-3-642-11598-1_2
Source records
- crossref · retrieved 2026-11-11T03:27:10.523Z