A Temperature-Aware Placement and Routing Algorithm Targeting 3D FPGAs

Kostas Siozios, Dimitrios Soudris

Open source

DOI: 10.1007/978-3-642-12267-5_12
Published: 2010
Container: IFIP Advances in Information and Communication Technology
Publisher: Springer Berlin Heidelberg
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1007/978-3-642-12267-5_12,
  title = {A Temperature-Aware Placement and Routing Algorithm Targeting 3D FPGAs},
  author = {Kostas Siozios and Dimitrios Soudris},
  year = {2010},
  journal = {IFIP Advances in Information and Communication Technology},
  doi = {10.1007/978-3-642-12267-5_12},
  url = {https://doi.org/10.1007/978-3-642-12267-5_12}
}

RIS

TY  - JOUR
TI  - A Temperature-Aware Placement and Routing Algorithm Targeting 3D FPGAs
AU  - Kostas Siozios
AU  - Dimitrios Soudris
PY  - 2010
JO  - IFIP Advances in Information and Communication Technology
DO  - 10.1007/978-3-642-12267-5_12
UR  - https://doi.org/10.1007/978-3-642-12267-5_12
ER  -

APA

Siozios, K., & Soudris, D. (2010). A Temperature-Aware Placement and Routing Algorithm Targeting 3D FPGAs. IFIP Advances in Information and Communication Technology. https://doi.org/10.1007/978-3-642-12267-5_12

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crossref · retrieved 2026-09-25T12:28:53.265Z