Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System
- DOI
- 10.1007/978-3-642-28163-1_19
- Published
- 2012
- Container
- IFIP Advances in Information and Communication Technology
- Publisher
- Springer Berlin Heidelberg
- Open access
- unknown
Credibility signals
uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- supportingDOI registered: A matching record was returned by Crossref.
- supportingDOI resolves: A matching record was returned by Crossref.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredOpen access status: Not checked or no result supplied; no credibility inference made.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- not scoredPublication version: A publication version was supplied but is not scored.
- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.1007/978-3-642-28163-1_19,
title = {Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System},
author = {Minna Lanz and Eeva Järvenpää and Pasi Luostarinen and Fernando Garcia and Reijo Tuokko},
year = {2012},
journal = {IFIP Advances in Information and Communication Technology},
doi = {10.1007/978-3-642-28163-1_19},
url = {https://doi.org/10.1007/978-3-642-28163-1_19}
}RIS
TY - JOUR TI - Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System AU - Minna Lanz AU - Eeva Järvenpää AU - Pasi Luostarinen AU - Fernando Garcia AU - Reijo Tuokko PY - 2012 JO - IFIP Advances in Information and Communication Technology DO - 10.1007/978-3-642-28163-1_19 UR - https://doi.org/10.1007/978-3-642-28163-1_19 ER -
APA
Lanz, M., Järvenpää, E., Luostarinen, P., Garcia, F., & Tuokko, R. (2012). Towards Intelligent Assembly and Manufacturing Environment – Modular ICT Support for Holonic Manufacturing System. IFIP Advances in Information and Communication Technology. https://doi.org/10.1007/978-3-642-28163-1_19
Source records
- crossref · retrieved 2026-11-07T01:18:56.523Z