A bi-potential contact formulation of orthotropic adhesion between soft bodies

L. B. Hu, Y. Cong, C. Renaud, Z.-Q. Feng

Open source

DOI: 10.1007/s00466-021-02122-1
Published: 2021-12-01
Container: Computational Mechanics
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1007/s00466-021-02122-1,
  title = {A bi-potential contact formulation of orthotropic adhesion between soft bodies},
  author = {L. B. Hu and Y. Cong and C. Renaud and Z.-Q. Feng},
  year = {2021},
  journal = {Computational Mechanics},
  doi = {10.1007/s00466-021-02122-1},
  url = {https://doi.org/10.1007/s00466-021-02122-1}
}

RIS

TY  - JOUR
TI  - A bi-potential contact formulation of orthotropic adhesion between soft bodies
AU  - L. B. Hu
AU  - Y. Cong
AU  - C. Renaud
AU  - Z.-Q. Feng
PY  - 2021
JO  - Computational Mechanics
DO  - 10.1007/s00466-021-02122-1
UR  - https://doi.org/10.1007/s00466-021-02122-1
ER  -

APA

Hu, L. B., Cong, Y., Renaud, C., & Feng, Z. (2021). A bi-potential contact formulation of orthotropic adhesion between soft bodies. Computational Mechanics. https://doi.org/10.1007/s00466-021-02122-1

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crossref · retrieved 2026-09-25T10:53:01.418Z