Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components

T. Kohlmeier, V. Seidemann, S. Büttgenbach, H. H. Gatzen

Open source

DOI: 10.1007/s00542-001-0154-6
Published: 2002-08-01
Container: Microsystem Technologies
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1007/s00542-001-0154-6,
  title = {Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components},
  author = {T. Kohlmeier and V. Seidemann and S. Büttgenbach and H. H. Gatzen},
  year = {2002},
  journal = {Microsystem Technologies},
  doi = {10.1007/s00542-001-0154-6},
  url = {https://doi.org/10.1007/s00542-001-0154-6}
}

RIS

TY  - JOUR
TI  - Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components
AU  - T. Kohlmeier
AU  - V. Seidemann
AU  - S. Büttgenbach
AU  - H. H. Gatzen
PY  - 2002
JO  - Microsystem Technologies
DO  - 10.1007/s00542-001-0154-6
UR  - https://doi.org/10.1007/s00542-001-0154-6
ER  -

APA

Kohlmeier, T., Seidemann, V., Büttgenbach, S., & Gatzen, H. H. (2002). Application of UV depth lithography and 3D-microforming for high aspect ratio electromagnetic microactuator components. Microsystem Technologies. https://doi.org/10.1007/s00542-001-0154-6

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crossref · retrieved 2026-09-25T19:10:49.385Z