RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

A. Surendar, Waluyo Adi Siswanto, Maryam Alijani, K. Alhaifi, Mohammad Salmani

DOI: 10.1007/s00542-019-04435-x
Published: 2019-04-27
Container: Microsystem Technologies
Publisher: Springer Science and Business Media LLC
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1007/s00542-019-04435-x,
  title = {RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages},
  author = {A. Surendar and Waluyo Adi Siswanto and Maryam Alijani and K. Alhaifi and Mohammad Salmani},
  year = {2019},
  journal = {Microsystem Technologies},
  doi = {10.1007/s00542-019-04435-x},
  url = {https://doi.org/10.1007/s00542-019-04435-x}
}

RIS

TY  - JOUR
TI  - RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages
AU  - A. Surendar
AU  - Waluyo Adi Siswanto
AU  - Maryam Alijani
AU  - K. Alhaifi
AU  - Mohammad Salmani
PY  - 2019
JO  - Microsystem Technologies
DO  - 10.1007/s00542-019-04435-x
UR  - https://doi.org/10.1007/s00542-019-04435-x
ER  -

APA

Surendar, A., Siswanto, W. A., Alijani, M., Alhaifi, K., & Salmani, M. (2019). RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages. Microsystem Technologies. https://doi.org/10.1007/s00542-019-04435-x

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crossref · retrieved 2026-09-25T00:25:24.505Z