Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.

Hsieh CL, Coyle RJ, Xian JW, Gourlay CM

DOI: 10.1007/s10853-026-12718-8
Published: 2026
Container: Journal of materials science
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1007/s10853-026-12718-8,
  title = {Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.},
  author = {Hsieh CL and Coyle RJ and Xian JW and Gourlay CM},
  year = {2026},
  journal = {Journal of materials science},
  doi = {10.1007/s10853-026-12718-8},
  url = {https://doi.org/10.1007/s10853-026-12718-8}
}

RIS

TY  - JOUR
TI  - Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.
AU  - Hsieh CL
AU  - Coyle RJ
AU  - Xian JW
AU  - Gourlay CM
PY  - 2026
JO  - Journal of materials science
DO  - 10.1007/s10853-026-12718-8
UR  - https://doi.org/10.1007/s10853-026-12718-8
ER  -

APA

CL, H., RJ, C., JW, X., & CM, G. (2026). Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.. Journal of materials science. https://doi.org/10.1007/s10853-026-12718-8

Source records

pubmed · retrieved 2026-09-26T05:02:20.232Z