Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.

Sun S, Li A, Cheng C, Gourlay CM

DOI: 10.1007/s10854-025-14979-6
Published: 2025
Container: Journal of materials science. Materials in electronics
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1007/s10854-025-14979-6,
  title = {Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.},
  author = {Sun S and Li A and Cheng C and Gourlay CM},
  year = {2025},
  journal = {Journal of materials science. Materials in electronics},
  doi = {10.1007/s10854-025-14979-6},
  url = {https://doi.org/10.1007/s10854-025-14979-6}
}

RIS

TY  - JOUR
TI  - Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.
AU  - Sun S
AU  - Li A
AU  - Cheng C
AU  - Gourlay CM
PY  - 2025
JO  - Journal of materials science. Materials in electronics
DO  - 10.1007/s10854-025-14979-6
UR  - https://doi.org/10.1007/s10854-025-14979-6
ER  -

APA

S, S., A, L., C, C., & CM, G. (2025). Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls.. Journal of materials science. Materials in electronics. https://doi.org/10.1007/s10854-025-14979-6

Source records

pubmed · retrieved 2026-09-26T10:12:53.426Z