Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.

Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM

DOI: 10.1007/s10854-025-15979-2
Published: 2025
Container: Journal of materials science. Materials in electronics
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1007/s10854-025-15979-2,
  title = {Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.},
  author = {Hsieh CL and Coyle RJ and Belyakov SA and Xian JW and Gourlay CM},
  year = {2025},
  journal = {Journal of materials science. Materials in electronics},
  doi = {10.1007/s10854-025-15979-2},
  url = {https://doi.org/10.1007/s10854-025-15979-2}
}

RIS

TY  - JOUR
TI  - Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.
AU  - Hsieh CL
AU  - Coyle RJ
AU  - Belyakov SA
AU  - Xian JW
AU  - Gourlay CM
PY  - 2025
JO  - Journal of materials science. Materials in electronics
DO  - 10.1007/s10854-025-15979-2
UR  - https://doi.org/10.1007/s10854-025-15979-2
ER  -

APA

CL, H., RJ, C., SA, B., JW, X., & CM, G. (2025). Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling.. Journal of materials science. Materials in electronics. https://doi.org/10.1007/s10854-025-15979-2

Source records

pubmed · retrieved 2026-09-26T04:25:09.295Z
europe-pmc · retrieved 2026-09-26T04:25:09.312Z