RETRACTED ARTICLE: Nanoparticle effect of heat conduction mechanism during solidification of PCM

Zhihong Dai, Alibek Issakhov, Mahmoud Mohamed Selim

Open source

DOI
10.1007/s13204-021-01999-x
Published
2021-08-03
Container
Applied Nanoscience
Publisher
Springer Science and Business Media LLC
Open access
unknown

Credibility signals

serious concern Score 29/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1007/s13204-021-01999-x,
  title = {RETRACTED ARTICLE: Nanoparticle effect of heat conduction mechanism during solidification of PCM},
  author = {Zhihong Dai and Alibek Issakhov and Mahmoud Mohamed Selim},
  year = {2021},
  journal = {Applied Nanoscience},
  doi = {10.1007/s13204-021-01999-x},
  url = {https://doi.org/10.1007/s13204-021-01999-x}
}

RIS

TY  - JOUR
TI  - RETRACTED ARTICLE: Nanoparticle effect of heat conduction mechanism during solidification of PCM
AU  - Zhihong Dai
AU  - Alibek Issakhov
AU  - Mahmoud Mohamed Selim
PY  - 2021
JO  - Applied Nanoscience
DO  - 10.1007/s13204-021-01999-x
UR  - https://doi.org/10.1007/s13204-021-01999-x
ER  - 

APA

Dai, Z., Issakhov, A., & Selim, M. M. (2021). RETRACTED ARTICLE: Nanoparticle effect of heat conduction mechanism during solidification of PCM. Applied Nanoscience. https://doi.org/10.1007/s13204-021-01999-x

Source records