Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility

Yuheng Jiang, Zihao Chen, Xiao Sun, Haotian Li, Jinlong Xie, Yueting Li, Xiaolei Nie, Feng Lan, Yaxin Zhang, Qiye Wen

Open source

DOI
10.1007/s40820-026-02312-7
Published
2026-07-30
Container
Nano-Micro Letters
Publisher
Springer Science and Business Media LLC
Open access
unknown

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BibTeX

@article{allodium:10.1007/s40820-026-02312-7,
  title = {Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility},
  author = {Yuheng Jiang and Zihao Chen and Xiao Sun and Haotian Li and Jinlong Xie and Yueting Li and Xiaolei Nie and Feng Lan and Yaxin Zhang and Qiye Wen},
  year = {2026},
  journal = {Nano-Micro Letters},
  doi = {10.1007/s40820-026-02312-7},
  url = {https://doi.org/10.1007/s40820-026-02312-7}
}

RIS

TY  - JOUR
TI  - Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility
AU  - Yuheng Jiang
AU  - Zihao Chen
AU  - Xiao Sun
AU  - Haotian Li
AU  - Jinlong Xie
AU  - Yueting Li
AU  - Xiaolei Nie
AU  - Feng Lan
AU  - Yaxin Zhang
AU  - Qiye Wen
PY  - 2026
JO  - Nano-Micro Letters
DO  - 10.1007/s40820-026-02312-7
UR  - https://doi.org/10.1007/s40820-026-02312-7
ER  - 

APA

Jiang, Y., Chen, Z., Sun, X., Li, H., Xie, J., Li, Y., Nie, X., Lan, F., Zhang, Y., & Wen, Q. (2026). Rheologically Engineered 3D-Printed Highly Loaded Magneto-Dielectric Absorbers for Device-Level Electromagnetic Compatibility. Nano-Micro Letters. https://doi.org/10.1007/s40820-026-02312-7

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