Chemometric analysis of AlSiCu metallization process for very large scale integrated circuits

Ming-Kaan Liang, Yong-Chien Ling

Open source

DOI: 10.1016/0003-2670(92)85012-u
Published: 1992-09
Container: Analytica Chimica Acta
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0003-2670-92-85012-u,
  title = {Chemometric analysis of AlSiCu metallization process for very large scale integrated circuits},
  author = {Ming-Kaan Liang and Yong-Chien Ling},
  year = {1992},
  journal = {Analytica Chimica Acta},
  doi = {10.1016/0003-2670(92)85012-u},
  url = {https://doi.org/10.1016/0003-2670(92)85012-u}
}

RIS

TY  - JOUR
TI  - Chemometric analysis of AlSiCu metallization process for very large scale integrated circuits
AU  - Ming-Kaan Liang
AU  - Yong-Chien Ling
PY  - 1992
JO  - Analytica Chimica Acta
DO  - 10.1016/0003-2670(92)85012-u
UR  - https://doi.org/10.1016/0003-2670(92)85012-u
ER  -

APA

Liang, M., & Ling, Y. (1992). Chemometric analysis of AlSiCu metallization process for very large scale integrated circuits. Analytica Chimica Acta. https://doi.org/10.1016/0003-2670(92)85012-u

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crossref · retrieved 2026-09-25T14:20:41.932Z