Determination of stresses in thermal oxide films on copper and iron during electrometric reduction

P. Poole, L.L. Shreir

Open source

DOI: 10.1016/0013-4686(68)80027-1
Published: 1968-02
Container: Electrochimica Acta
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0013-4686-68-80027-1,
  title = {Determination of stresses in thermal oxide films on copper and iron during electrometric reduction},
  author = {P. Poole and L.L. Shreir},
  year = {1968},
  journal = {Electrochimica Acta},
  doi = {10.1016/0013-4686(68)80027-1},
  url = {https://doi.org/10.1016/0013-4686(68)80027-1}
}

RIS

TY  - JOUR
TI  - Determination of stresses in thermal oxide films on copper and iron during electrometric reduction
AU  - P. Poole
AU  - L.L. Shreir
PY  - 1968
JO  - Electrochimica Acta
DO  - 10.1016/0013-4686(68)80027-1
UR  - https://doi.org/10.1016/0013-4686(68)80027-1
ER  -

APA

Poole, P., & Shreir, L. (1968). Determination of stresses in thermal oxide films on copper and iron during electrometric reduction. Electrochimica Acta. https://doi.org/10.1016/0013-4686(68)80027-1

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crossref · retrieved 2026-11-10T14:14:33.324Z