Reliability AuSn flip-chip bonding on flexible prints

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Open source

DOI: 10.1016/0026-2714(96)84472-6
Published: 1996-04
Container: Microelectronics Reliability
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0026-2714-96-84472-6,
  title = {Reliability AuSn flip-chip bonding on flexible prints},
  year = {1996},
  journal = {Microelectronics Reliability},
  doi = {10.1016/0026-2714(96)84472-6},
  url = {https://doi.org/10.1016/0026-2714(96)84472-6}
}

RIS

TY  - JOUR
TI  - Reliability AuSn flip-chip bonding on flexible prints
PY  - 1996
JO  - Microelectronics Reliability
DO  - 10.1016/0026-2714(96)84472-6
UR  - https://doi.org/10.1016/0026-2714(96)84472-6
ER  -

APA

Reliability AuSn flip-chip bonding on flexible prints. (1996). Microelectronics Reliability. https://doi.org/10.1016/0026-2714(96)84472-6

Source records

crossref · retrieved 2026-09-26T17:37:56.742Z