Diffusion in several materials relevant to Cu interconnection technology

D. Gupta

Open source

DOI: 10.1016/0254-0584(95)01514-0
Published: 1995-08
Container: Materials Chemistry and Physics
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0254-0584-95-01514-0,
  title = {Diffusion in several materials relevant to Cu interconnection technology},
  author = {D. Gupta},
  year = {1995},
  journal = {Materials Chemistry and Physics},
  doi = {10.1016/0254-0584(95)01514-0},
  url = {https://doi.org/10.1016/0254-0584(95)01514-0}
}

RIS

TY  - JOUR
TI  - Diffusion in several materials relevant to Cu interconnection technology
AU  - D. Gupta
PY  - 1995
JO  - Materials Chemistry and Physics
DO  - 10.1016/0254-0584(95)01514-0
UR  - https://doi.org/10.1016/0254-0584(95)01514-0
ER  -

APA

Gupta, D. (1995). Diffusion in several materials relevant to Cu interconnection technology. Materials Chemistry and Physics. https://doi.org/10.1016/0254-0584(95)01514-0

Source records

crossref · retrieved 2026-09-25T21:07:56.970Z