Encapsulation by interfacial polycondensation. III. Microencapsulation; the influence of process conditions on wall permeability

L.J.J.M. Janssen, A. Boersma, K. te Nijenhuis

Open source

DOI: 10.1016/0376-7388(93)85014-n
Published: 1993-04-26
Container: Journal of Membrane Science
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0376-7388-93-85014-n,
  title = {Encapsulation by interfacial polycondensation. III. Microencapsulation; the influence of process conditions on wall permeability},
  author = {L.J.J.M. Janssen and A. Boersma and K. te Nijenhuis},
  year = {1993},
  journal = {Journal of Membrane Science},
  doi = {10.1016/0376-7388(93)85014-n},
  url = {https://doi.org/10.1016/0376-7388(93)85014-n}
}

RIS

TY  - JOUR
TI  - Encapsulation by interfacial polycondensation. III. Microencapsulation; the influence of process conditions on wall permeability
AU  - L.J.J.M. Janssen
AU  - A. Boersma
AU  - K. te Nijenhuis
PY  - 1993
JO  - Journal of Membrane Science
DO  - 10.1016/0376-7388(93)85014-n
UR  - https://doi.org/10.1016/0376-7388(93)85014-n
ER  -

APA

Janssen, L., Boersma, A., & Nijenhuis, K. T. (1993). Encapsulation by interfacial polycondensation. III. Microencapsulation; the influence of process conditions on wall permeability. Journal of Membrane Science. https://doi.org/10.1016/0376-7388(93)85014-n

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crossref · retrieved 2026-09-25T23:25:24.506Z