In-process inspection of IC under packaging by single laser beam and photosensors

Ichiro Kimura

Open source

DOI: 10.1016/0924-4247(89)80029-9
Published: 1990-06
Container: Sensors and Actuators A: Physical
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/0924-4247-89-80029-9,
  title = {In-process inspection of IC under packaging by single laser beam and photosensors},
  author = {Ichiro Kimura},
  year = {1990},
  journal = {Sensors and Actuators A: Physical},
  doi = {10.1016/0924-4247(89)80029-9},
  url = {https://doi.org/10.1016/0924-4247(89)80029-9}
}

RIS

TY  - JOUR
TI  - In-process inspection of IC under packaging by single laser beam and photosensors
AU  - Ichiro Kimura
PY  - 1990
JO  - Sensors and Actuators A: Physical
DO  - 10.1016/0924-4247(89)80029-9
UR  - https://doi.org/10.1016/0924-4247(89)80029-9
ER  -

APA

Kimura, I. (1990). In-process inspection of IC under packaging by single laser beam and photosensors. Sensors and Actuators A: Physical. https://doi.org/10.1016/0924-4247(89)80029-9

Source records

crossref · retrieved 2026-09-25T14:43:12.563Z